LPC55S28JBD64K vs LPC55S69JBD64K

This detailed comparison of LPC55S28JBD64K and LPC55S69JBD64K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S28JBD64K

LPC55S28JBD64K

NXP Semiconductors

LPC55S69JBD64K

LPC55S69JBD64K

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Description IC MCU 32BIT 512KB FLASH 64HTQFP IC MCU 32BIT 640KB FLASH 64HTQFP
In Stock 461 6 537
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC55S2x LPC55S6x
Package Tray Tray
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit 32-Bit
Speed 150MHz 150MHz
Connectivity Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 36 36
Program Memory Size 512KB (512K x 8) 640KB (640K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 256K x 8 320K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b A/D 10x16b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10)
Part Number Manufacturer Description Request For Quote
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