LPC55S66JBD100K vs LPC5526JBD100K

This detailed comparison of LPC55S66JBD100K and LPC5526JBD100K in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

LPC55S66JBD100K

LPC55S66JBD100K

NXP Semiconductors

LPC5526JBD100K

LPC5526JBD100K

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 100-LQFP Exposed Pad 100-LQFP Exposed Pad
Description IC MCU 32BIT 256KB FLSH 100HLQFP IC MCU 32BIT 256KB FLSH 100HLQFP
In Stock 7 987 3 662
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series LPC55S6x LPC552x
Package Tray Tray
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit 32-Bit
Speed 150MHz 150MHz
Connectivity Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O 64 64
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 144K x 8 144K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 10x16b A/D 10x16b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 100-HLQFP (14x14) 100-HLQFP (14x14)
Part Number Manufacturer Description Request For Quote
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ATSAMC21E18A-AUT Roving Networks / Microchip Technology IC MCU 32BIT 256KB FLASH 32TQFP
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MC56F84550VLFR NXP Semiconductors IC MCU 32BIT 96KB FLASH 48LQFP
DSPIC33CK128MP502T-I/2N Roving Networks / Microchip Technology IC MCU 16BIT 128KB FLASH 28UQFN
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