This detailed comparison of LS102MASE7EHA and LS101MAXE7DFA in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
|---|---|---|
| Package / Case | 448-FBGA Exposed Pad | 448-FBGA Exposed Pad |
| Description | IC PROCESSOR DUAL CORE | IC PROCESSOR DUAL CORE |
| In Stock | 1 984 | 1 783 |
| Mounting Type | - | - |
| Part Status | Obsolete | Obsolete |
| Series | QorlQ LS1 | QorlQ LS1 |
| Package | Tray | Tray |
| Core Processor | ARM1136JF-S | ARM1136JF-S |
| Number of Cores/Bus Width | 2 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 650MHz | 650MHz |
| Co-Processors/DSP | - | - |
| RAM Controllers | DDR2 | DDR2 |
| Graphics Acceleration | No | No |
| Display & Interface Controllers | - | - |
| Ethernet | GbE (2) | GbE (2) |
| SATA | - | - |
| USB | USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I/O | - | - |
| Operating Temperature | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) |
| Security Features | - | - |
| Supplier Device Package | 448-PBGA w/Heat Spreader (23x23) | 448-PBGA w/Heat Spreader (23x23) |
