MB89193AHPF-G-646-ERE1 vs MB89193APF-G-454-BND-RE1

This detailed comparison of MB89193AHPF-G-646-ERE1 and MB89193APF-G-454-BND-RE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89193AHPF-G-646-ERE1

MB89193AHPF-G-646-ERE1

Cypress Semiconductor

MB89193APF-G-454-BND-RE1

MB89193APF-G-454-BND-RE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 28-SOIC (0.342", 8.69mm Width) 28-SOIC (0.342", 8.69mm Width)
Description IC MCU 8BIT 8KB MROM 28SOP IC MCU 8BIT 8KB MROM 28SOP
In Stock 6 480 1 182
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89190A F²MC-8L MB89190A
Package Tray Tube
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 4.2MHz 4.2MHz
Connectivity Serial I/O Serial I/O
Peripherals POR, WDT POR, WDT
Number of I/O 16 16
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 256 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x8b A/D 8x8b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SOP 28-SOP
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