MB89657ARPFV-G-334-BND vs MB89657ARPFV-G-337-BNDE1

This detailed comparison of MB89657ARPFV-G-334-BND and MB89657ARPFV-G-337-BNDE1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89657ARPFV-G-334-BND

MB89657ARPFV-G-334-BND

Cypress Semiconductor

MB89657ARPFV-G-337-BNDE1

MB89657ARPFV-G-337-BNDE1

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 100-LQFP 100-LQFP
Description IC MCU 8BIT 32KB MROM 100LQFP IC MCU 8BIT 32KB MROM 100LQFP
In Stock 5 267 6 547
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series F²MC-8L MB89650AR F²MC-8L MB89650AR
Package Tray Tray
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity Serial I/O Serial I/O
Peripherals LCD, POR, PWM, WDT LCD, POR, PWM, WDT
Number of I/O 48 48
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 1K x 8 1K x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V 2.2V ~ 6V
Data Converters A/D 8x8b A/D 8x8b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 100-LQFP (14x14) 100-LQFP (14x14)
Part Number Manufacturer Description Request For Quote
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