MB89935BPFV-GS-277-ERE1 vs MB89935BPFV-G-266-BND-ER

This detailed comparison of MB89935BPFV-GS-277-ERE1 and MB89935BPFV-G-266-BND-ER in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89935BPFV-GS-277-ERE1

MB89935BPFV-GS-277-ERE1

Cypress Semiconductor

MB89935BPFV-G-266-BND-ER

MB89935BPFV-G-266-BND-ER

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 30-LSSOP (0.220", 5.60mm Width) 30-LSSOP (0.220", 5.60mm Width)
Description IC MCU 8BIT 16KB MROM 30SSOP IC MCU 8BIT 16KB MROM 30SSOP
In Stock 8 390 1 440
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series F²MC-8L MB89930A F²MC-8L MB89930A
Package Tube Tube
Core Processor F²MC-8L F²MC-8L
Core Size 8-Bit 8-Bit
Speed 10MHz 10MHz
Connectivity Serial I/O, UART/USART Serial I/O, UART/USART
Peripherals POR, PWM, WDT POR, PWM, WDT
Number of I/O 21 21
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Mask ROM Mask ROM
EEPROM Size - -
RAM Size 512 x 8 512 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 5.5V 2.2V ~ 5.5V
Data Converters A/D 8x10b A/D 8x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 30-SSOP 30-SSOP
Part Number Manufacturer Description Request For Quote
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