MB89P637P-G-SH-TLE1 vs MB89637RP-G-1417-SH

This detailed comparison of MB89P637P-G-SH-TLE1 and MB89637RP-G-1417-SH in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MB89P637P-G-SH-TLE1

Cypress Semiconductor

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MB89637RP-G-1417-SH

Cypress Semiconductor

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Specifications Hide identical items

Manufacturer	Cypress Semiconductor	Cypress Semiconductor
Package / Case	64-DIP (0.750", 19.05mm)	64-DIP (0.750", 19.05mm)
Description	IC MCU 8BIT 32KB OTP 64-SH-DIP	IC MCU 8BIT 32KB MROM 64-SH-DIP
In Stock	2 500	7 123
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Active
Series	F²MC-8L MB89630	F²MC-8L MB89630R
Package	Tube	Tube
Core Processor	F²MC-8L	F²MC-8L
Core Size	8-Bit	8-Bit
Speed	10MHz	10MHz
Connectivity	EBI/EMI, Serial I/O, UART/USART	EBI/EMI, Serial I/O, UART/USART
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	OTP	Mask ROM
EEPROM Size	-	-
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 6V	2.2V ~ 6V
Data Converters	A/D 8x10b	A/D 8x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-SH-DIP	64-SH-DIP