MC56F8355MFGE vs MC56F8355VFGE

This detailed comparison of MC56F8355MFGE and MC56F8355VFGE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC56F8355MFGE

NXP Semiconductors

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MC56F8355VFGE

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	128-LQFP	128-LQFP
Description	IC MCU 16BIT 256KB FLASH 128LQFP	IC MCU 16BIT 256KB FLASH 128LQFP
In Stock	357	329
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	56F8xxx	56F8xxx
Package	Tray	Tray
Core Processor	56800E	56800E
Core Size	16-Bit	16-Bit
Speed	60MHz	60MHz
Connectivity	CANbus, EBI/EMI, SCI, SPI	CANbus, EBI/EMI, SCI, SPI
Peripherals	POR, PWM, Temp Sensor, WDT	POR, PWM, Temp Sensor, WDT
Number of I/O	49	49
Program Memory Size	256KB (128K x 16)	256KB (128K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	10K x 16	10K x 16
Voltage - Supply (Vcc/Vdd)	2.25V ~ 3.6V	2.25V ~ 3.6V
Data Converters	A/D 16x12b	A/D 16x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	128-LQFP (14x20)	128-LQFP (14x20)