MC56F8365MFGE vs MC56F8365VFGE

This detailed comparison of MC56F8365MFGE and MC56F8365VFGE in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC56F8365MFGE

MC56F8365MFGE

NXP Semiconductors

MC56F8365VFGE

MC56F8365VFGE

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 128-LQFP 128-LQFP
Description IC MCU 16BIT 512KB FLASH 128LQFP IC MCU 16BIT 512KB FLASH 128LQFP
In Stock 366 360
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series 56F8xxx 56F8xxx
Package Tray Tray
Core Processor 56800E 56800E
Core Size 16-Bit 16-Bit
Speed 60MHz 60MHz
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT
Number of I/O 49 49
Program Memory Size 512KB (256K x 16) 512KB (256K x 16)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 18K x 16 18K x 16
Voltage - Supply (Vcc/Vdd) 2.25V ~ 3.6V 2.25V ~ 3.6V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 128-LQFP (14x20) 128-LQFP (14x20)
Part Number Manufacturer Description Request For Quote
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