MC68376BGCAB25 vs SC68376BGCAB25

This detailed comparison of MC68376BGCAB25 and SC68376BGCAB25 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC68376BGCAB25

NXP Semiconductors

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SC68376BGCAB25

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	160-BQFP	160-BQFP
Description	IC MCU 32BIT ROMLESS 160QFP	IC MCU 32BIT ROMLESS 160QFP
In Stock	7 217	10 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Not For New Designs
Series	M683xx	M683xx
Package	Tray	Tray
Core Processor	CPU32	CPU32
Core Size	32-Bit	32-Bit
Speed	25MHz	25MHz
Connectivity	CANbus, EBI/EMI, SCI, SPI	CANbus, EBI/EMI, SCI, SPI
Peripherals	POR, PWM, WDT	POR, PWM, WDT
Number of I/O	18	18
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	7.5K x 8	7.5K x 8
Voltage - Supply (Vcc/Vdd)	4.75V ~ 5.25V	4.75V ~ 5.25V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	160-QFP (28x28)	160-QFP (28x28)