MC9S08SH8CPJ vs MC9S08SH8MPJ

This detailed comparison of MC9S08SH8CPJ and MC9S08SH8MPJ in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08SH8CPJ

NXP Semiconductors

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MC9S08SH8MPJ

VIGOR

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	VIGOR
Package / Case	20-DIP (0.300", 7.62mm)	20-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 8KB FLASH 20DIP	IC MCU 8BIT 8KB FLASH 20DIP
In Stock	2 775	744
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	S08	S08
Package	Tube	Bulk
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Connectivity	I²C, LINbus, SCI, SPI	I²C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	17	17
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	512 x 8	512 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 12x10b	A/D 12x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	20-DIP	20-DIP