MC9S08SH8MPJ vs MC9S08SH4CPJ

This detailed comparison of MC9S08SH8MPJ and MC9S08SH4CPJ in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S08SH8MPJ

VIGOR

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MC9S08SH4CPJ

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	20-DIP (0.300", 7.62mm)	20-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 8KB FLASH 20DIP	IC MCU 8BIT 4KB FLASH 20DIP
In Stock	744	36
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	S08	S08
Package	Bulk	Tube
Core Processor	S08	S08
Core Size	8-Bit	8-Bit
Speed	40MHz	40MHz
Connectivity	I²C, LINbus, SCI, SPI	I²C, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	17	17
Program Memory Size	8KB (8K x 8)	4KB (4K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	512 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 12x10b	A/D 12x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	20-DIP	20-DIP