MC9S12XDP512CAL vs MC9S12XDP512MAL

This detailed comparison of MC9S12XDP512CAL and MC9S12XDP512MAL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12XDP512CAL

NXP Semiconductors

Request For Quote

MC9S12XDP512MAL

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 16BIT 512KB FLASH 112LQFP	IC MCU 16BIT 512KB FLASH 112LQFP
In Stock	474	195
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	HCS12X	HCS12X
Package	Tray	Tray
Core Processor	HCS12X	HCS12X
Core Size	16-Bit	16-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI	CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	91	91
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	4K x 8
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.5V	2.35V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)