MC9S12XDT256CAL vs MC9S12XDT256MAL

This detailed comparison of MC9S12XDT256CAL and MC9S12XDT256MAL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MC9S12XDT256CAL

NXP Semiconductors

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MC9S12XDT256MAL

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 16BIT 256KB FLASH 112LQFP	IC MCU 16BIT 256KB FLASH 112LQFP
In Stock	450	97
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	HCS12X	HCS12X
Package	Tray	Tray
Core Processor	HCS12X	HCS12X
Core Size	16-Bit	16-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI	CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	91	91
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	4K x 8
RAM Size	16K x 8	16K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.5V	2.35V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)