MCF5275LCVM166 vs MCF5275LCVM166J

This detailed comparison of MCF5275LCVM166 and MCF5275LCVM166J in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCF5275LCVM166

NXP Semiconductors

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MCF5275LCVM166J

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	196-LBGA	196-LBGA
Description	IC MCU 32BIT ROMLESS 196MAPBGA	IC MCU 32BIT ROMLESS 196MAPBGA
In Stock	10	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	MCF527x	MCF527x
Package	Tray	Tray
Core Processor	Coldfire V2	Coldfire V2
Core Size	32-Bit	32-Bit
Speed	166MHz	166MHz
Connectivity	EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB	EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals	DMA, WDT	DMA, WDT
Number of I/O	61	61
Program Memory Size	-	-
Program Memory Type	ROMless	ROMless
EEPROM Size	-	-
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.4V ~ 1.6V	1.4V ~ 1.6V
Data Converters	-	-
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	196-MAPBGA (15x15)	196-MAPBGA (15x15)