MCIMX233DJM4C vs MCIMX233DJM4CR2

This detailed comparison of MCIMX233DJM4C and MCIMX233DJM4CR2 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX233DJM4C

NXP Semiconductors

Request For Quote

MCIMX233DJM4CR2

NXP Semiconductors

Request For Quote

Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	169-LFBGA	169-LFBGA
Description	IC MPU I.MX23 454MHZ 169MAPBGA	IC MPU I.MX23 454MHZ 169MAPBGA
In Stock	488	1 490
Mounting Type	-	-
Part Status	Active	Active
Series	i.MX23	i.MX23
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	ARM926EJ-S	ARM926EJ-S
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	454MHz	454MHz
Co-Processors/DSP	Data; DCP	Data; DCP
RAM Controllers	DRAM	DRAM
Graphics Acceleration	No	No
Display & Interface Controllers	LCD, Touchscreen	LCD, Touchscreen
Ethernet	-	-
SATA	-	-
USB	USB 2.0 + PHY (1)	USB 2.0 + PHY (1)
Voltage - I/O	2.0V, 2.5V, 2.7V, 3.0V, 3.3V	2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature	-10°C ~ 70°C (TA)	-10°C ~ 70°C (TA)
Security Features	Cryptography, Hardware ID	Cryptography, Hardware ID
Supplier Device Package	169-MAPBGA (11x11)	169-MAPBGA (11x11)