MCIMX535DVV1CR2 vs MCIMX535DVV2C

This detailed comparison of MCIMX535DVV1CR2 and MCIMX535DVV2C in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX535DVV1CR2

VIGOR

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MCIMX535DVV2C

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	VIGOR	NXP Semiconductors
Package / Case	529-FBGA	529-FBGA
Description	MULTIFUNCTION PERIPHERAL, CMOS,	IC MPU I.MX53 1.2GHZ 529TEBGA
In Stock	660	4 518
Mounting Type	-	-
Part Status	Active	Obsolete
Series	i.MX53	i.MX53
Package	Bulk	Tray
Core Processor	ARM® Cortex®-A8	ARM® Cortex®-A8
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	1.0GHz	1.2GHz
Co-Processors/DSP	Multimedia; NEON™ SIMD	Multimedia; NEON™ SIMD
RAM Controllers	LPDDR2, DDR2, DDR3	LPDDR2, DDR2, DDR3
Graphics Acceleration	Yes	Yes
Display & Interface Controllers	Keypad, LCD	Keypad, LCD
Ethernet	10/100Mbps (1)	10/100Mbps (1)
SATA	SATA 1.5Gbps (1)	SATA 1.5Gbps (1)
USB	USB 2.0 (2), USB 2.0 + PHY (2)	USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O	1.3V, 1.8V, 2.775V, 3.3V	1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature	-20°C ~ 85°C (TC)	-20°C ~ 85°C (TC)
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Supplier Device Package	529-FBGA (19x19)	529-FBGA (19x19)