MCIMX537CVV8C vs MCIMX537CVV8CR2

This detailed comparison of MCIMX537CVV8C and MCIMX537CVV8CR2 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MCIMX537CVV8C

NXP Semiconductors

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MCIMX537CVV8CR2

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	529-FBGA	529-FBGA
Description	IC MPU I.MX53 800MHZ 529TEBGA-2	IC MPU I.MX53 800MHZ 529TEBGA-2
In Stock	100	0
Mounting Type	-	-
Part Status	Obsolete	Obsolete
Series	i.MX53	i.MX53
Package	Tray	Tape & Reel (TR)
Core Processor	ARM® Cortex®-A8	ARM® Cortex®-A8
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	800MHz	800MHz
Co-Processors/DSP	Multimedia; NEON™ SIMD	Multimedia; NEON™ SIMD
RAM Controllers	LPDDR2, DDR2, DDR3	LPDDR2, DDR2, DDR3
Graphics Acceleration	Yes	Yes
Display & Interface Controllers	Keypad, LCD	Keypad, LCD
Ethernet	10/100Mbps (1)	10/100Mbps (1)
SATA	SATA 1.5Gbps (1)	SATA 1.5Gbps (1)
USB	USB 2.0 (2), USB 2.0 + PHY (2)	USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O	1.3V, 1.8V, 2.775V, 3.3V	1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Supplier Device Package	529-FBGA (19x19)	529-FBGA (19x19)