MK50DN512CMD10 vs MK50DN512CMD10R

This detailed comparison of MK50DN512CMD10 and MK50DN512CMD10R in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK50DN512CMD10

NXP Semiconductors

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MK50DN512CMD10R

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	144-LBGA	144-LBGA
Description	IC MCU 32B 512KB FLASH 144MAPBGA	IC MCU 32B 512KB FLASH 144MAPBGA
In Stock	100	1 479
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K50	Kinetis K50
Package	Tray	Tape & Reel (TR)
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	100MHz	100MHz
Connectivity	EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LVD, POR, PWM, WDT	DMA, I²S, LVD, POR, PWM, WDT
Number of I/O	96	96
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	128K x 8	128K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 41x16b; D/A 2x12b	A/D 41x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	144-MAPBGA (13x13)	144-MAPBGA (13x13)