MK70FN1M0VMJ12 vs MK70FX512VMJ15

This detailed comparison of MK70FN1M0VMJ12 and MK70FX512VMJ15 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MK70FN1M0VMJ12

NXP Semiconductors

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MK70FX512VMJ15

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	256-LBGA	256-LBGA
Description	IC MCU 32BIT 1MB FLSH 256MAPPBGA	IC MCU 32B 512KB FLSH 256MAPPBGA
In Stock	12	300
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Kinetis K70	Kinetis K70
Package	Tray	Tray
Core Processor	ARM® Cortex®-M4	ARM® Cortex®-M4
Core Size	32-Bit	32-Bit
Speed	120MHz	150MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	128	128
Program Memory Size	1MB (1M x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	16K x 8
RAM Size	128K x 8	128K x 8
Voltage - Supply (Vcc/Vdd)	1.71V ~ 3.6V	1.71V ~ 3.6V
Data Converters	A/D 71x16b; D/A 2x12b	A/D 71x16b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	256-MAPPBGA (17x17)	256-MAPPBGA (17x17)