This detailed comparison of MPC850SRZQ66BU and XPC850DEZT66BU in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
|---|---|---|
| Package / Case | 256-BBGA | 256-BGA |
| Description | IC MPU MPC8XX 66MHZ 256BGA | IC MPU MPC8XX 66MHZ 256BGA |
| In Stock | 975 | 4 129 |
| Mounting Type | - | - |
| Part Status | Obsolete | Obsolete |
| Series | MPC8xx | MPC8xx |
| Package | Tray | Tray |
| Core Processor | MPC8xx | MPC8xx |
| Number of Cores/Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 66MHz | 66MHz |
| Co-Processors/DSP | Communications; CPM | Communications; CPM |
| RAM Controllers | DRAM | DRAM |
| Graphics Acceleration | No | No |
| Display & Interface Controllers | - | - |
| Ethernet | 10Mbps (1) | 10Mbps (1) |
| SATA | - | - |
| USB | USB 1.x (1) | USB 1.x (1) |
| Voltage - I/O | 3.3V | 3.3V |
| Operating Temperature | 0°C ~ 95°C (TA) | 0°C ~ 95°C (TA) |
| Security Features | - | - |
| Supplier Device Package | 256-PBGA (23x23) | 256-PBGA (23x23) |
