MT53D1024M32D4NQ-046 WT:D TR vs MT53D1024M32D4NQ-046 WT ES:D TR

This detailed comparison of MT53D1024M32D4NQ-046 WT:D TR and MT53D1024M32D4NQ-046 WT ES:D TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MT53D1024M32D4NQ-046 WT:D TR

Micron Technology

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MT53D1024M32D4NQ-046 WT ES:D TR

Micron Technology

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Specifications Hide identical items

Manufacturer	Micron Technology	Micron Technology
Package / Case	200-VFBGA	200-VFBGA
Description	IC DRAM 32GBIT 2133MHZ 200VFBGA	IC DRAM 32GBIT 2133MHZ 200VFBGA
In Stock	910	274
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	-	-
Package	Tape & Reel (TR)	Tape & Reel (TR)
Memory Type	Volatile	Volatile
Memory Format	DRAM	DRAM
Technology	SDRAM - Mobile LPDDR4	SDRAM - Mobile LPDDR4
Memory Size	32Gb (1G x 32)	32Gb (1G x 32)
Memory Interface	-	-
Clock Frequency	2.133 GHz	2.133 GHz
Write Cycle Time - Word, Page	-	-
Access Time	-	-
Voltage - Supply	1.1V	1.1V
Operating Temperature	-30°C ~ 85°C (TC)	-30°C ~ 85°C (TC)
Supplier Device Package	200-VFBGA (10x14.5)	200-VFBGA (10x14.5)