MVF30NN152CKU26 vs MVF30NS152CKU26

This detailed comparison of MVF30NN152CKU26 and MVF30NS152CKU26 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MVF30NN152CKU26

NXP Semiconductors

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MVF30NS152CKU26

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	176-LQFP Exposed Pad	176-LQFP Exposed Pad
Description	IC MCU 32BIT ROMLESS 176LQFP	IC MCU 32BIT ROMLESS 176LQFP
In Stock	455	790
Mounting Type	-	-
Part Status	Active	Active
Series	Vybrid, VF3xx	Vybrid, VF3xx
Package	Tray	Tray
Core Processor	ARM® Cortex®-A5	ARM® Cortex®-A5
Number of Cores/Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	266MHz	266MHz
Co-Processors/DSP	Multimedia; NEON™ MPE	Multimedia; NEON™ MPE
RAM Controllers	LPDDR2, DDR3, DRAM	LPDDR2, DDR3, DRAM
Graphics Acceleration	Yes	Yes
Display & Interface Controllers	DCU, GPU, LCD, VideoADC, VIU	DCU, GPU, LCD, VideoADC, VIU
Ethernet	10/100Mbps (2)	10/100Mbps (2)
SATA	-	-
USB	USB 2.0 OTG + PHY (1)	USB 2.0 OTG + PHY (1)
Voltage - I/O	3.3V	3.3V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Security Features	-	ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Supplier Device Package	176-LQFP-EP (24x24)	176-LQFP-EP (24x24)