MVF30NS152CKU26 vs MVF30NS151CKU26

This detailed comparison of MVF30NS152CKU26 and MVF30NS151CKU26 in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

MVF30NS152CKU26

MVF30NS152CKU26

NXP Semiconductors

MVF30NS151CKU26

MVF30NS151CKU26

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 176-LQFP Exposed Pad 176-LQFP Exposed Pad
Description IC MCU 32BIT ROMLESS 176LQFP IC MCU 32BIT ROMLESS 176LQFP
In Stock 790 223
Mounting Type - -
Part Status Active Active
Series Vybrid, VF3xx Vybrid, VF3xx
Package Tray Tray
Core Processor ARM® Cortex®-A5 ARM® Cortex®-A5
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 266MHz 266MHz
Co-Processors/DSP Multimedia; NEON™ MPE Multimedia; NEON™ MPE
RAM Controllers LPDDR2, DDR3, DRAM LPDDR2, DDR3, DRAM
Graphics Acceleration Yes Yes
Display & Interface Controllers DCU, GPU, LCD, VideoADC, VIU DCU, GPU, LCD, VideoADC, VIU
Ethernet 10/100Mbps (2) 10/100Mbps (2)
SATA - -
USB USB 2.0 OTG + PHY (1) USB 2.0 OTG + PHY (1)
Voltage - I/O 3.3V 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Security Features ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Supplier Device Package 176-LQFP-EP (24x24) 176-LQFP-EP (24x24)
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