P89LPC936FDH,518 vs P89LPC936FDH,529

This detailed comparison of P89LPC936FDH,518 and P89LPC936FDH,529 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

P89LPC936FDH,518

P89LPC936FDH,518

NXP Semiconductors

P89LPC936FDH,529

P89LPC936FDH,529

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP (0.173", 4.40mm Width)
Description IC MCU 8BIT 16KB FLASH 28TSSOP IC MCU 8BIT 16KB FLASH 28TSSOP
In Stock 100 0
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series LPC900 LPC900
Package Tape & Reel (TR)Cut Tape (CT)Digi-Reel® Tube
Core Processor 8051 8051
Core Size 8-Bit 8-Bit
Speed 18MHz 18MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O 26 26
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 512 x 8 512 x 8
RAM Size 768 x 8 768 x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V 2.4V ~ 3.6V
Data Converters A/D 8x8b; D/A 2x8b A/D 8x8b; D/A 2x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-TSSOP 28-TSSOP
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