PIC12F1822T-I/MF vs PIC12LF1822-I/MF

This detailed comparison of PIC12F1822T-I/MF and PIC12LF1822-I/MF in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC12F1822T-I/MF

Roving Networks / Microchip Technology

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PIC12LF1822-I/MF

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	8-VDFN Exposed Pad	8-VDFN Exposed Pad
Description	IC MCU 8BIT 3.5KB FLASH 8DFN	IC MCU 8BIT 3.5KB FLASH 8DFN
In Stock	201	135
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PIC® XLP™ 12F	PIC® XLP™ 12F
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	32MHz	32MHz
Connectivity	I²C, LINbus, SPI, UART/USART	I²C, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	6	6
Program Memory Size	3.5KB (2K x 14)	3.5KB (2K x 14)
Program Memory Type	FLASH	FLASH
EEPROM Size	256 x 8	256 x 8
RAM Size	128 x 8	128 x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 5.5V	1.8V ~ 3.6V
Data Converters	A/D 4x10b; D/A 1x5b	A/D 4x10b; D/A 1x5b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	8-DFN-EP (3x3)	8-DFN-EP (3x3)