PIC16C57C-04I/SP vs PIC16C55-XTI/SP

This detailed comparison of PIC16C57C-04I/SP and PIC16C55-XTI/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC16C57C-04I/SP

PIC16C57C-04I/SP

Roving Networks / Microchip Technology

PIC16C55-XTI/SP

PIC16C55-XTI/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 3KB OTP 28SPDIP IC MCU 8BIT 768B OTP 28SPDIP
In Stock 963 228
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® 16C PIC® 16C
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 4MHz 4MHz
Connectivity - -
Peripherals POR, WDT POR, WDT
Number of I/O 20 20
Program Memory Size 3KB (2K x 12) 768B (512 x 12)
Program Memory Type OTP OTP
EEPROM Size - -
RAM Size 72 x 8 24 x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 6.25V
Data Converters - -
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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