PIC18F24K50-E/SP vs PIC18LF24K50-E/SP

This detailed comparison of PIC18F24K50-E/SP and PIC18LF24K50-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F24K50-E/SP

Roving Networks / Microchip Technology

Request For Quote

PIC18LF24K50-E/SP

Roving Networks / Microchip Technology

Request For Quote

Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 16KB FLASH 28SPDIP	IC MCU 8BIT 16KB FLASH 28SPDIP
In Stock	165	140
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 18K	PIC® XLP™ 18K
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	48MHz	48MHz
Connectivity	I²C, SPI, UART/USART, USB	I²C, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	22	22
Program Memory Size	16KB (8K x 16)	16KB (8K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	256 x 8	256 x 8
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2.3V ~ 5.5V	1.8V ~ 3.6V
Data Converters	A/D 14x10b	A/D 14x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP