PIC18F27K40-I/SP vs PIC18LF26K40-I/SP

This detailed comparison of PIC18F27K40-I/SP and PIC18LF26K40-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F27K40-I/SP

Roving Networks / Microchip Technology

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PIC18LF26K40-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 128KB FLASH 28SDIP	IC MCU 8BIT 64KB FLASH 28SDIP
In Stock	160	163
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 18K	PIC® XLP™ 18K
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	64MHz	64MHz
Connectivity	I²C, LINbus, SPI, UART/USART	I²C, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, LVD, POR, PWM, WDT	Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O	25	25
Program Memory Size	128KB (64K x 16)	64KB (32K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	1K x 8	1K x 8
RAM Size	3.6K x 8	3.6K x 8
Voltage - Supply (Vcc/Vdd)	2.3V ~ 5.5V	1.8V ~ 3.6V
Data Converters	A/D 24x10b; D/A 1x5b	A/D 24x10b; D/A 1x5b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SDIP	28-SDIP