PIC18F66K22-E/MR vs PIC18F66K22-I/MRRSL

This detailed comparison of PIC18F66K22-E/MR and PIC18F66K22-I/MRRSL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F66K22-E/MR

PIC18F66K22-E/MR

Roving Networks / Microchip Technology

PIC18F66K22-I/MRRSL

PIC18F66K22-I/MRRSL

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Description IC MCU 8BIT 64KB FLASH 64VQFN IC MCU 8BIT 64KB FLASH 64VQFN
In Stock 906 548
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 18K
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 64MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O 53 53
Program Memory Size 64KB (32K x 16) 64KB (32K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 1K x 8
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-VQFN (9x9) 64-VQFN (9x9)
Part Number Manufacturer Description Request For Quote
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