PIC18LF2550-I/SP vs PIC18LF2455-I/SP

This detailed comparison of PIC18LF2550-I/SP and PIC18LF2455-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF2550-I/SP

PIC18LF2550-I/SP

Roving Networks / Microchip Technology

PIC18LF2455-I/SP

PIC18LF2455-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 32KB FLASH 28SPDIP IC MCU 8BIT 24KB FLASH 28SPDIP
In Stock 281 401
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® 18F PIC® 18F
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 48MHz
Connectivity I²C, SPI, UART/USART, USB I²C, SPI, UART/USART, USB
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 32KB (16K x 16) 24KB (12K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 256 x 8 256 x 8
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V 2V ~ 5.5V
Data Converters A/D 10x10b A/D 10x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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