PIC18LF25K80-I/SP vs PIC18F25K80-E/SP

This detailed comparison of PIC18LF25K80-I/SP and PIC18F25K80-E/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF25K80-I/SP

PIC18LF25K80-I/SP

Roving Networks / Microchip Technology

PIC18F25K80-E/SP

PIC18F25K80-E/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 32KB FLASH 28SPDIP IC MCU 8BIT 32KB FLASH 28SPDIP
In Stock 186 750
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18K PIC® XLP™ 18K
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 64MHz 64MHz
Connectivity ECANbus, I²C, LINbus, SPI, UART/USART ECANbus, I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 32KB (16K x 16) 32KB (16K x 16)
Program Memory Type FLASH FLASH
EEPROM Size 1K x 8 1K x 8
RAM Size 3.6K x 8 3.6K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 5.5V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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MC9S08PA8AMTG NXP Semiconductors IC MCU 8BIT 8KB FLASH 16TSSOP
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R5F564MFGDLC#21 Renesas Electronics America IC MCU 32BIT 2MB FLASH 177TFLGA
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