PIC18LF26J13-I/SP vs PIC18F27J13-I/SP

This detailed comparison of PIC18LF26J13-I/SP and PIC18F27J13-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18LF26J13-I/SP

PIC18LF26J13-I/SP

Roving Networks / Microchip Technology

PIC18F27J13-I/SP

PIC18F27J13-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 8BIT 64KB FLASH 28SPDIP IC MCU 8BIT 128KB FLASH 28SPDIP
In Stock 545 177
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 18J PIC® XLP™ 18J
Package Tube Tube
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 48MHz 48MHz
Connectivity I²C, LINbus, SPI, UART/USART I²C, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 22 22
Program Memory Size 64KB (32K x 16) 128KB (64K x 16)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 3.8K x 8 3.8K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 2.75V 2.15V ~ 3.6V
Data Converters A/D 10x10b/12b A/D 10x10b/12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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