PIC24FJ64GB002-I/SP vs PIC24FJ32GB002-I/SP

This detailed comparison of PIC24FJ64GB002-I/SP and PIC24FJ32GB002-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24FJ64GB002-I/SP

Roving Networks / Microchip Technology

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PIC24FJ32GB002-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 64KB FLASH 28SPDIP	IC MCU 16BIT 32KB FLASH 28SPDIP
In Stock	391	767
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 24F	PIC® XLP™ 24F
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	32MHz
Connectivity	I²C, IrDA, SPI, UART/USART, USB OTG	I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, LVD, POR, PWM, WDT	Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O	19	19
Program Memory Size	64KB (22K x 24)	32KB (11K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 9x10b	A/D 9x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP