PIC24FV16KA302-I/SP vs PIC24F16KA302-I/SP

This detailed comparison of PIC24FV16KA302-I/SP and PIC24F16KA302-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24FV16KA302-I/SP

PIC24FV16KA302-I/SP

Roving Networks / Microchip Technology

PIC24F16KA302-I/SP

PIC24F16KA302-I/SP

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 28-DIP (0.300", 7.62mm) 28-DIP (0.300", 7.62mm)
Description IC MCU 16BIT 16KB FLASH 28SPDIP IC MCU 16BIT 16KB FLASH 28SPDIP
In Stock 500 435
Mounting Type Through Hole Through Hole
Part Status Active Active
Series PIC® XLP™ 24F PIC® XLP™ 24F
Package Tube Tube
Core Processor PIC PIC
Core Size 16-Bit 16-Bit
Speed 32MHz 32MHz
Connectivity I²C, IrDA, LINbus, SPI, UART/USART I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number of I/O 23 24
Program Memory Size 16KB (5.5K x 24) 16KB (5.5K x 24)
Program Memory Type FLASH FLASH
EEPROM Size 512 x 8 512 x 8
RAM Size 2K x 8 2K x 8
Voltage - Supply (Vcc/Vdd) 2V ~ 5.5V 1.8V ~ 3.6V
Data Converters A/D 13x12b A/D 13x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 28-SPDIP 28-SPDIP
Part Number Manufacturer Description Request For Quote
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