PIC32MX170F256B-50I/SP vs PIC32MX170F256B-I/SP

This detailed comparison of PIC32MX170F256B-50I/SP and PIC32MX170F256B-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC32MX170F256B-50I/SP

Roving Networks / Microchip Technology

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PIC32MX170F256B-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 32BIT 256KB FLASH 28SPDIP	IC MCU 32BIT 256KB FLASH 28SPDIP
In Stock	218	386
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® 32MX	PIC® 32MX
Package	Tube	Tube
Core Processor	MIPS32® M4K™	MIPS32® M4K™
Core Size	32-Bit	32-Bit
Speed	50MHz	40MHz
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O	21	21
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.3V ~ 3.6V	2.3V ~ 3.6V
Data Converters	A/D 10x10b	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP