PIC32MZ2025DAR169-V/6J vs PIC32MZ2025DAK169-V/HF

This detailed comparison of PIC32MZ2025DAR169-V/6J and PIC32MZ2025DAK169-V/HF in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC32MZ2025DAR169-V/6J

Roving Networks / Microchip Technology

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PIC32MZ2025DAK169-V/HF

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	169-LFBGA	169-LFBGA
Description	IC MCU 32BIT 2MB FLASH 169LFBGA	IC MCU 32BIT 2MB FLASH 169LFBGA
In Stock	490	241
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PIC® 32MZ DAR	PIC® 32MZ DAK
Package	Tray	Tray
Core Processor	MIPS32® microAptiv™	MIPS32® microAptiv™
Core Size	32-Bit	32-Bit
Speed	200MHz	200MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG	CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Number of I/O	120	120
Program Memory Size	2MB (2M x 8)	2MB (2M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	256K x 8 + 32MB DDR2 SDRAM	256K x 8
Voltage - Supply (Vcc/Vdd)	1.7V ~ 1.9V	1.7V ~ 1.9V
Data Converters	A/D 45x12b	A/D 45x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 105°C (TA)
Supplier Device Package	169-LFBGA (11x11)	169-LFBGA (11x11)