R5F523W8BDNG#30 vs R5F523W8ADNG#30

This detailed comparison of R5F523W8BDNG#30 and R5F523W8ADNG#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F523W8BDNG#30

R5F523W8BDNG#30

Renesas Electronics America

R5F523W8ADNG#30

R5F523W8ADNG#30

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 56-VFQFN Exposed Pad 56-VFQFN Exposed Pad
Description IC MCU 32BIT 512KB FLASH 56HVQFN IC MCU 32BIT 512KB FLASH 56HVQFN
In Stock 40 213
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RX23W RX200
Package Tray Tray
Core Processor RXv2 RXv2
Core Size 32-Bit 32-Bit
Speed 54MHz 54MHz
Connectivity CANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTG CANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 29 29
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 8K x 8 8K x 8
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 12x12b; D/A 1x12b A/D 12x12b; D/A 1x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 56-HVQFN (7x7) 56-HVQFN (7x7)
Part Number Manufacturer Description Request For Quote
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