R5F563NBCDLC#U0 vs R5F563NDCDLC#U0

This detailed comparison of R5F563NBCDLC#U0 and R5F563NDCDLC#U0 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F563NBCDLC#U0

R5F563NBCDLC#U0

Renesas Electronics America

R5F563NDCDLC#U0

R5F563NDCDLC#U0

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 177-TFLGA 177-TFLGA
Description IC MCU 32BIT 1MB FLASH 177TFLGA IC MCU 32BIT 1.5MB FLSH 177TFLGA
In Stock 5 000 6 545
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RX600 RX600
Package Tray Tray
Core Processor RX RX
Core Size 32-Bit 32-Bit
Speed 100MHz 100MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, USB CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 133 133
Program Memory Size 1MB (1M x 8) 1.5MB (1.5M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 32K x 8 32K x 8
RAM Size 128K x 8 128K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 8x10b, 21x12b; D/A 2x10b A/D 8x10b, 21x12b; D/A 2x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 177-TFLGA (8x8) 177-TFLGA (8x8)
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