R5F563TEBDFH#V0 vs R5F563TEBDFH#V1

This detailed comparison of R5F563TEBDFH#V0 and R5F563TEBDFH#V1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F563TEBDFH#V0

R5F563TEBDFH#V0

Renesas Electronics America

R5F563TEBDFH#V1

R5F563TEBDFH#V1

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 112-LQFP 112-LQFP
Description IC MCU 32BIT 512KB FLASH 112LQFP IC MCU 32BIT 512KB FLASH 112LQFP
In Stock 1 186 2 088
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RX600 RX600
Package Tray Tray
Core Processor RX RX
Core Size 32-Bit 32-Bit
Speed 100MHz 100MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SCI, SPI, USB CANbus, EBI/EMI, I²C, LINbus, SCI, SPI, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 69 69
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 32K x 8 32K x 8
RAM Size 48K x 8 48K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Data Converters A/D 12x10b, 8x12b; D/A 2x10b A/D 12x10b, 8x12b; D/A 2x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 112-LQFP (20x20) 112-LQFP (20x20)
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