R5F564MGDDBG#21 vs R5F564MLGDBG#21

This detailed comparison of R5F564MGDDBG#21 and R5F564MLGDBG#21 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F564MGDDBG#21

Renesas Electronics America

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R5F564MLGDBG#21

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	176-LFBGA	176-LFBGA
Description	IC MCU 32BIT 2.5MB FLSH 176LFBGA	IC MCU 32BIT 4MB FLASH 176LFBGA
In Stock	1 360	8 946
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX600	RX600
Package	Tray	Tray
Core Processor	RXv2	RXv2
Core Size	32-Bit	32-Bit
Speed	120MHz	120MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	127	127
Program Memory Size	2.5MB (2.5M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	64K x 8	64K x 8
RAM Size	552K x 8	552K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 29x12b; D/A 2x12b	A/D 29x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	176-LFBGA (13x13)	176-LFBGA (13x13)