R5F566TEADFH#30 vs R5F566TEEDFH#30

This detailed comparison of R5F566TEADFH#30 and R5F566TEEDFH#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F566TEADFH#30

Renesas Electronics America

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R5F566TEEDFH#30

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	112-LQFP	112-LQFP
Description	IC MCU 32BIT 512KB FLASH 112LQFP	IC MCU 32BIT 512KB FLASH 112LQFP
In Stock	60	2 952
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Discontinued at Digi-Key
Series	RX66T	RX66T
Package	Tray	Tray
Core Processor	RXv3	RXv3
Core Size	32-Bit	32-Bit
Speed	160MHz	160MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART	CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	84	84
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 22x12b; D/A 2x12b	A/D 22x12b; D/A 2x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	112-LQFP (20x20)	112-LQFP (20x20)