R7F701406EABG-C#BC1 vs R7F701406EABG-C#HC1

This detailed comparison of R7F701406EABG-C#BC1 and R7F701406EABG-C#HC1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R7F701406EABG-C#BC1

R7F701406EABG-C#BC1

Renesas Electronics America

R7F701406EABG-C#HC1

R7F701406EABG-C#HC1

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 272-BGA 272-BGA
Description IC MCU 32BIT 3.75MB FLASH 272BGA IC MCU 32BIT 3.75MB FLASH 272BGA
In Stock 4 640 5 806
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RH850/D1x RH850/D1x
Package Tray Tray
Core Processor RH850G3M RH850G3M
Core Size 32-Bit 32-Bit
Speed 200MHz 200MHz
Connectivity CANbus, CSI, I²C, LINbus, SPI, UART/USART CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals DMA, PWM, WDT DMA, PWM, WDT
Number of I/O 126 126
Program Memory Size 3.75MB (3.75M x 8) 3.75MB (3.75M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 64K x 8 64K x 8
RAM Size 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ)
Supplier Device Package 272-BGA (21x21) 272-BGA (21x21)
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