R7F701408EABG-C#AC1 vs R7F701408EABG-C#HC1

This detailed comparison of R7F701408EABG-C#AC1 and R7F701408EABG-C#HC1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R7F701408EABG-C#AC1

R7F701408EABG-C#AC1

Renesas Electronics America

R7F701408EABG-C#HC1

R7F701408EABG-C#HC1

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 376-BGA 376-BGA
Description IC MCU 32BIT 3.75MB FLASH 376BGA IC MCU 32BIT 3.75MB FLASH 376BGA
In Stock 2 135 5 994
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RH850/D1x RH850/D1x
Package Tray Tray
Core Processor RH850G3M RH850G3M
Core Size 32-Bit 32-Bit
Speed 240MHz 240MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 159 159
Program Memory Size 3.75MB (3.75M x 8) 3.75MB (3.75M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 64K x 8 64K x 8
RAM Size 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 20x8b A/D 20x8b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TJ) -40°C ~ 150°C (TJ)
Supplier Device Package 376-BGA (23x23) 376-BGA (23x23)
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