R7F701408EABG-C#HC1 vs R7F701408EABG-C#AC1

This detailed comparison of R7F701408EABG-C#HC1 and R7F701408EABG-C#AC1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R7F701408EABG-C#HC1

Renesas Electronics America

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R7F701408EABG-C#AC1

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	376-BGA	376-BGA
Description	IC MCU 32BIT 3.75MB FLASH 376BGA	IC MCU 32BIT 3.75MB FLASH 376BGA
In Stock	5 994	2 135
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RH850/D1x	RH850/D1x
Package	Tray	Tray
Core Processor	RH850G3M	RH850G3M
Core Size	32-Bit	32-Bit
Speed	240MHz	240MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB	CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals	DMA, I²S, LCD, LVD, POR, PWM, WDT	DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O	159	159
Program Memory Size	3.75MB (3.75M x 8)	3.75MB (3.75M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	64K x 8	64K x 8
RAM Size	512K x 8	512K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	2.7V ~ 5.5V
Data Converters	A/D 20x8b	A/D 20x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 150°C (TJ)	-40°C ~ 150°C (TJ)
Supplier Device Package	376-BGA (23x23)	376-BGA (23x23)