S1C17W15F005100 vs S1C17W15F005100-160

This detailed comparison of S1C17W15F005100 and S1C17W15F005100-160 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S1C17W15F005100

S1C17W15F005100

Epson

S1C17W15F005100-160

S1C17W15F005100-160

Epson

Specifications
Manufacturer Epson Epson
Package / Case Die Die
Description IC MCU 16BIT 64KB FLASH DIE IC MCU 16BIT 64KB FLASH DIE
In Stock 6 000 2 840
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tray Tray
Core Processor S1C17 S1C17
Core Size 16-Bit 16-Bit
Speed 4.2MHz 4.2MHz
Connectivity I²C, IrDA, SPI, UART/USART I²C, IrDA, SPI, UART/USART
Peripherals LCD, POR, PWM, RFC, SNDA, WDT LCD, POR, PWM, RFC, SNDA, WDT
Number of I/O 32 32
Program Memory Size 64KB (64K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.2V ~ 3.6V 1.2V ~ 3.6V
Data Converters - -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package Die Die
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