S912XEP100J5CVL vs MC9S12XEP100CVL

This detailed comparison of S912XEP100J5CVL and MC9S12XEP100CVL in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S912XEP100J5CVL

NXP Semiconductors

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MC9S12XEP100CVL

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	208-BGA	208-BGA
Description	IC MCU 16BIT 1MB FLASH 208MAPBGA	IC MCU 16BIT 1MB FLASH 208MAPBGA
In Stock	1 379	2 000
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	HCS12X	HCS12X
Package	Tray	Tray
Core Processor	HCS12X	HCS12X
Core Size	16-Bit	16-Bit
Speed	50MHz	50MHz
Connectivity	CANbus, EBI/EMI, I²C, IrDA, SCI, SPI	CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals	LVD, POR, PWM, WDT	LVD, POR, PWM, WDT
Number of I/O	152	152
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	4K x 8	4K x 8
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	1.72V ~ 5.5V	1.72V ~ 5.5V
Data Converters	A/D 32x12b	A/D 32x12b
Oscillator Type	External	External
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	208-MAPBGA (17x17)	208-MAPBGA (17x17)