SPC5517EAMMG66 vs SPC5517GAMMG66

This detailed comparison of SPC5517EAMMG66 and SPC5517GAMMG66 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SPC5517EAMMG66

NXP Semiconductors

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SPC5517GAMMG66

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	208-BGA	208-BGA
Description	IC MCU 32B 1.5MB FLASH 208MAPBGA	IC MCU 32B 1.5MB FLASH 208MAPBGA
In Stock	1 908	1 989
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	MPC55xx Qorivva	MPC55xx Qorivva
Package	Tray	Tray
Core Processor	e200z0, e200z1	e200z0, e200z1
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	66MHz	66MHz
Connectivity	CANbus, EBI/EMI, I²C, SCI, SPI	CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	144	144
Program Memory Size	1.5MB (1.5M x 8)	1.5MB (1.5M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	80K x 8	80K x 8
Voltage - Supply (Vcc/Vdd)	4.5V ~ 5.25V	4.5V ~ 5.25V
Data Converters	A/D 40x12b	A/D 40x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	208-MAPBGA (17x17)	208-MAPBGA (17x17)