SPC5775BDK3MME2 vs SPC5775EDK3MME3R

This detailed comparison of SPC5775BDK3MME2 and SPC5775EDK3MME3R in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SPC5775BDK3MME2

NXP Semiconductors

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SPC5775EDK3MME3R

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	416-BGA	416-BGA
Description	IC MCU 32BIT 4MB FLASH 416MAPBGA	IC MCU 32BIT 4MB FLASH 416MAPBGA
In Stock	183	1 989
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MPC57xx	MPC57xx
Package	Tray	Tape & Reel (TR)
Core Processor	e200z7	e200z7
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	220MHz	264MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, Zipwire	DMA, LVD, POR, Zipwire
Number of I/O	293	293
Program Memory Size	4MB (4M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	512K x 8	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 40x12b eQADCx2	A/D 40x12b eQADCx2
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	416-MAPBGA (27x27)	416-MAPBGA (27x27)