SPC5775BDK3MME2 vs SPC5775EDK3MME3

This detailed comparison of SPC5775BDK3MME2 and SPC5775EDK3MME3 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SPC5775BDK3MME2

NXP Semiconductors

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SPC5775EDK3MME3

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	416-BGA	416-BGA
Description	IC MCU 32BIT 4MB FLASH 416MAPBGA	IC MCU 32BIT 4MB FLASH 416MAPBGA
In Stock	183	150
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MPC57xx	MPC57xx
Package	Tray	Tray
Core Processor	e200z7	e200z7
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	220MHz	264MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI	CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, Zipwire	DMA, LVD, POR, Zipwire
Number of I/O	293	293
Program Memory Size	4MB (4M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	512K x 8	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 40x12b eQADCx2	A/D 40x12b eQADCx2
Oscillator Type	External	External
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	416-MAPBGA (27x27)	416-MAPBGA (27x27)